| Message ID | 20240614-dt-bindings-thermal-allof-v1-10-30b25a6ae24e@linaro.org |
|---|---|
| State | Accepted |
| Commit | c1bca276d8100b141a1244e8e357b0bbfbc2bed3 |
| Headers | show
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From: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Date: Fri, 14 Jun 2024 11:46:09 +0200
Subject: [PATCH 10/22] dt-bindings: thermal: qcom-spmi-adc-tm5: reference
thermal-sensor schema
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To: Daniel Lezcano <daniel.lezcano@linaro.org>,
Zhang Rui <rui.zhang@intel.com>, Lukasz Luba <lukasz.luba@arm.com>,
Rob Herring <robh@kernel.org>, Conor Dooley <conor+dt@kernel.org>,
Alim Akhtar <alim.akhtar@samsung.com>,
Guillaume La Roque <glaroque@baylibre.com>,
Krzysztof Kozlowski <krzk+dt@kernel.org>,
Vasily Khoruzhick <anarsoul@gmail.com>, Chen-Yu Tsai <wens@csie.org>,
Jernej Skrabec <jernej.skrabec@gmail.com>,
Samuel Holland <samuel@sholland.org>, Shawn Guo <shawnguo@kernel.org>,
Sascha Hauer <s.hauer@pengutronix.de>,
Pengutronix Kernel Team <kernel@pengutronix.de>,
Fabio Estevam <festevam@gmail.com>, Anson Huang <Anson.Huang@nxp.com>,
Thierry Reding <thierry.reding@gmail.com>,
Jonathan Hunter <jonathanh@nvidia.com>,
Dmitry Baryshkov <dmitry.baryshkov@linaro.org>,
Amit Kucheria <amitk@kernel.org>,
=?utf-8?q?Niklas_S=C3=B6derlund?= <niklas.soderlund@ragnatech.se>,
Heiko Stuebner <heiko@sntech.de>, Biju Das <biju.das.jz@bp.renesas.com>,
Orson Zhai <orsonzhai@gmail.com>,
Baolin Wang <baolin.wang@linux.alibaba.com>,
Chunyan Zhang <zhang.lyra@gmail.com>,
Alexandre Torgue <alexandre.torgue@foss.st.com>,
Pascal Paillet <p.paillet@foss.st.com>, Keerthy <j-keerthy@ti.com>,
Broadcom internal kernel review list
<bcm-kernel-feedback-list@broadcom.com>,
Florian Fainelli <florian.fainelli@broadcom.com>,
Scott Branden <sbranden@broadcom.com>,
zhanghongchen <zhanghongchen@loongson.cn>,
Matthias Brugger <matthias.bgg@gmail.com>,
AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>,
Bjorn Andersson <andersson@kernel.org>,
Geert Uytterhoeven <geert+renesas@glider.be>
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linux-stm32@st-md-mailman.stormreply.com,
Florian Fainelli <f.fainelli@gmail.com>,
linux-rpi-kernel@lists.infradead.org, linux-mediatek@lists.infradead.org,
Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
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| Series |
dt-bindings: thermal: few cleanups
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expand
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diff --git a/Documentation/devicetree/bindings/thermal/qcom-spmi-adc-tm5.yaml b/Documentation/devicetree/bindings/thermal/qcom-spmi-adc-tm5.yaml index d9d2657287cb..4470a5942fb2 100644 --- a/Documentation/devicetree/bindings/thermal/qcom-spmi-adc-tm5.yaml +++ b/Documentation/devicetree/bindings/thermal/qcom-spmi-adc-tm5.yaml @@ -8,6 +8,8 @@ title: Qualcomm's SPMI PMIC ADC Thermal Monitoring maintainers: - Dmitry Baryshkov <dmitry.baryshkov@linaro.org> +$ref: thermal-sensor.yaml# + properties: compatible: enum: @@ -23,9 +25,6 @@ properties: "#thermal-sensor-cells": const: 1 - description: - Number of cells required to uniquely identify the thermal sensors. Since - we have multiple sensors this is set to 1 "#address-cells": const: 1 @@ -159,9 +158,8 @@ required: - interrupts - "#address-cells" - "#size-cells" - - "#thermal-sensor-cells" -additionalProperties: false +unevaluatedProperties: false examples: - |
Device is a thermal sensor and it requires '#thermal-sensor-cells', so reference the thermal-sensor.yaml to simplify it and bring the common definition of '#thermal-sensor-cells' property. Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> --- Documentation/devicetree/bindings/thermal/qcom-spmi-adc-tm5.yaml | 8 +++----- 1 file changed, 3 insertions(+), 5 deletions(-)