mbox series

[0/3] arm64: qcom: Introduce Qualcomm Cooling Driver suppport

Message ID 20220912091643.3537857-1-bhupesh.sharma@linaro.org
Headers show
Series arm64: qcom: Introduce Qualcomm Cooling Driver suppport | expand

Message

Bhupesh Sharma Sept. 12, 2022, 9:16 a.m. UTC 
This patchset introduces the arm64 dts and defconfig changes for introducing
the Qualcomm Cooling Driver (aka Qualcomm Thermal Mitigation Driver).

Several Qualcomm Snapdragon SoCs have Thermal Mitigation Devices (TMDs)
present on various remote subsystem(s) (for e.g. the Compute DSP, aka cDSP),
which can be used for several mitigations for remote subsystem(s), including
remote processor mitigation, rail voltage restriction etc. 

At the very top-level, the dts is supposed to describe a TMD node, which
should further represent the remote subsystem(s) present on the SoC and
further each child of a subsystem should represent the separate cooling devices
available on the remote subsystem.

Note that this patchset is targeted for the 'linux-arm-msm' tree and the thermal
driver/dtbinding patchset/changes targeted for 'linux-pm' tree has been sent as a
separate patchset (see [1]). Note that without the PATCH mentioned in
[2] this patchset will not compile cleanly.

This patchset is based on the latest 'linux-next/master'.

[1]. https://lore.kernel.org/linux-arm-msm/20220912085049.3517140-1-bhupesh.sharma@linaro.org/
[2]. https://lore.kernel.org/linux-arm-msm/20220912085049.3517140-4-bhupesh.sharma@linaro.org/

Cc: andersson@kernel.org
Cc: robh@kernel.org
Cc: daniel.lezcano@linaro.org
Cc: rafael@kernel.org

Bhupesh Sharma (3):
  arm64: dts: qcom: sm8150: Add qmi cooling device nodes
  arm64: dts: qcom: sa8155p-adp: Enable qmi cooling device
  arm64: defconfig: Enable Qualcomm QMI cooling device driver

 arch/arm64/boot/dts/qcom/sa8155p-adp.dts |  4 ++
 arch/arm64/boot/dts/qcom/sm8150.dtsi     | 62 ++++++++++++++++++++++++
 arch/arm64/configs/defconfig             |  1 +
 3 files changed, 67 insertions(+)