| Message ID | 20220426221523.3056696-1-daniel.lezcano@linexp.org |
|---|---|
| Headers | show |
| Series | thermal OF rework | expand |
On Wed, Apr 27, 2022 at 12:15 AM Daniel Lezcano <daniel.lezcano@linexp.org> wrote: > > The thermal framework initialization with the device tree appears to > be complicated and hard to make it to evolve. > > It contains duplication of almost the same thermal generic structures > and has an assymetric initialization making hard any kind of serious > changes for more complex features. One of them is the multiple sensors > support per thermal zone. > > In order to set the scene for the aforementioned feature with generic > code, we need to cleanup and rework the device tree initialization. > > However this rework is not obvious because of the multiple components > entering in the composition of a thermal zone and being initialized at > different moments. For instance, a cooling device can be initialized > before a sensor, so the thermal zones must exist before the cooling > device as well as the sensor. This asynchonous initialization forces > the thermal zone to be created with fake ops because they are > mandotory and build a list of cooling devices which is used to lookup > afterwards when the cooling device driver is registering itself. > > Actually, the correct behavior IMHO, would be having a sensor > registration resulting in the thermal zone creation. If the cooling > device is registered before, it won't find the thermal zone and should > return -EPROBE_DEFER. > > As there could be a large number of changes, this first series provide > some steps forward for a simpler device tree initialization. > > The first patch could appear scary as it touches a big number of files > but it is actually just renaming a structure name > > Daniel Lezcano (15): > thermal/core: Rename thermal_zone_device to thermal_zone > thermal/core: Change thermal_zone_ops to thermal_sensor_ops > thermal/core: Add a thermal sensor structure in the thermal zone > thermal/core: Remove duplicate information when an error occurs > thermal/of: Replace device node match with device node search > thermal/of: Remove the device node pointer for thermal_trip > thermal/of: Move thermal_trip structure to thermal.h > thermal/core: Remove unneeded EXPORT_SYMBOLS > thermal/core: Move thermal_set_delay_jiffies to static > thermal/core: Rename trips to ntrips > thermal/core: Add thermal_trip in thermal_zone > thermal/core: Register with the trip points > thermal/of: Store the trips in the thermal zone > thermal/of: Use thermal trips stored in the thermal zone > thermal/of: Initialize trip points separately Generally, the series looks reasonable to me, but I'm not convinced about the first patch. It looks like a decision needs to be made regarding how exactly a "thermal zone" is going to be defined now and how it is going to be related to thermal sensors. My basic question is this: If trip points are associated with thermal sensors, then what a thermal zone really is and what is it useful for?