| Message ID | cover.1585738725.git.amit.kucheria@linaro.org |
|---|---|
| Headers | show |
| Series | Convert thermal bindings to yaml | expand |
Hi Amit, Apart from small mistake during probably copy-paste (please check below), looks good. On 4/1/20 12:15 PM, Amit Kucheria wrote: > As part of moving the thermal bindings to YAML, split it up into 3 > bindings: thermal sensors, cooling devices and thermal zones. > > The thermal-zone binding is a software abstraction to capture the > properties of each zone - how often they should be checked, the > temperature thresholds (trips) at which mitigation actions need to be > taken and the level of mitigation needed at those thresholds. > > Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org> > Reviewed-by: Rob Herring <robh@kernel.org> > --- > Changes since v3: > - Clarify example by using cooling state numbers and a comment > - Restrict thermal-sensors to a single reference to reflect actual code > where there is a one-to-one mapping between sensors and thermal zones > - Add two optional properties that were missed in earlier submissions: > coefficients and sustainable-power > - Improve description of hysteresis and contribution properties > > .../bindings/thermal/thermal-zones.yaml | 341 ++++++++++++++++++ > 1 file changed, 341 insertions(+) > create mode 100644 Documentation/devicetree/bindings/thermal/thermal-zones.yaml > [snip] > + cooling-maps { > + map0 { > + trip = <&cpu0_alert0>; > + /* Corresponds to 1400MHz in OPP table */ > + cooling-device = <&CPU0 3 3>, <&CPU1 3 3>, > + <&CPU2 3 3>, <&CPU3 3 3>; > + }; > + > + map1 { > + trip = <&cpu0_alert1>; > + /* Corresponds to 1400MHz in OPP table */ s/1400MHz/1000MHz/ 1400MHZ is used in map0 as <&CPUx 3 3>, here we have '5 5'. > + cooling-device = <&CPU0 5 5>, <&CPU1 5 5>, > + <&CPU2 5 5>, <&CPU3 5 5>; > + }; > + }; > + }; Apart from that, looks good: Reviewed-by: Lukasz Luba <lukasz.luba@arm.com> Regards, Lukasz
On 4/1/20 12:15 PM, Amit Kucheria wrote: > As part of moving the thermal bindings to YAML, split it up into 3 > bindings: thermal sensors, cooling devices and thermal zones. > > The property #thermal-sensor-cells is required in each device that acts > as a thermal sensor. It is used to uniquely identify the instance of the > thermal sensor inside the system. > > Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org> > Reviewed-by: Rob Herring <robh@kernel.org> > --- > .../bindings/thermal/thermal-sensor.yaml | 72 +++++++++++++++++++ > 1 file changed, 72 insertions(+) > create mode 100644 Documentation/devicetree/bindings/thermal/thermal-sensor.yaml > > diff --git a/Documentation/devicetree/bindings/thermal/thermal-sensor.yaml b/Documentation/devicetree/bindings/thermal/thermal-sensor.yaml > new file mode 100644 > index 0000000000000..920ee7667591d > --- /dev/null > +++ b/Documentation/devicetree/bindings/thermal/thermal-sensor.yaml > @@ -0,0 +1,72 @@ > +# SPDX-License-Identifier: (GPL-2.0) > +# Copyright 2020 Linaro Ltd. > +%YAML 1.2 > +--- > +$id: http://devicetree.org/schemas/thermal/thermal-sensor.yaml# > +$schema: http://devicetree.org/meta-schemas/core.yaml# > + > +title: Thermal sensor binding > + > +maintainers: > + - Amit Kucheria <amitk@kernel.org> > + > +description: | > + Thermal management is achieved in devicetree by describing the sensor hardware > + and the software abstraction of thermal zones required to take appropriate > + action to mitigate thermal overloads. > + > + The following node types are used to completely describe a thermal management > + system in devicetree: > + - thermal-sensor: device that measures temperature, has SoC-specific bindings > + - cooling-device: device used to dissipate heat either passively or artively s/artively/actively > + - thermal-zones: a container of the following node types used to describe all > + thermal data for the platform > + > + This binding describes the thermal-sensor. > + > + Thermal sensor devices provide temperature sensing capabilities on thermal > + zones. Typical devices are I2C ADC converters and bandgaps. Thermal sensor > + devices may control one or more internal sensors. > + > +properties: > + "#thermal-sensor-cells": > + description: > + Used to uniquely identify a thermal sensor instance within an IC. Will be > + 0 on sensor nodes with only a single sensor and at least 1 on nodes > + containing several internal sensors. > + enum: [0, 1] > + > +examples: > + - | > + #include <dt-bindings/interrupt-controller/arm-gic.h> > + > + // Example 1: SDM845 TSENS > + soc: soc@0 { > + #address-cells = <2>; > + #size-cells = <2>; > + > + /* ... */ > + > + tsens0: thermal-sensor@c263000 { > + compatible = "qcom,sdm845-tsens", "qcom,tsens-v2"; > + reg = <0 0x0c263000 0 0x1ff>, /* TM */ > + <0 0x0c222000 0 0x1ff>; /* SROT */ > + #qcom,sensors = <13>; > + interrupts = <GIC_SPI 506 IRQ_TYPE_LEVEL_HIGH>, > + <GIC_SPI 508 IRQ_TYPE_LEVEL_HIGH>; > + interrupt-names = "uplow", "critical"; > + #thermal-sensor-cells = <1>; > + }; > + > + tsens1: thermal-sensor@c265000 { > + compatible = "qcom,sdm845-tsens", "qcom,tsens-v2"; > + reg = <0 0x0c265000 0 0x1ff>, /* TM */ > + <0 0x0c223000 0 0x1ff>; /* SROT */ > + #qcom,sensors = <8>; > + interrupts = <GIC_SPI 507 IRQ_TYPE_LEVEL_HIGH>, > + <GIC_SPI 509 IRQ_TYPE_LEVEL_HIGH>; > + interrupt-names = "uplow", "critical"; > + #thermal-sensor-cells = <1>; > + }; > + }; > +... > Apart from the above, looks good. Reviewed-by: Lukasz Luba <lukasz.luba@arm.com> Regards, Lukasz
On Wed, Apr 1, 2020 at 6:10 PM Lukasz Luba <lukasz.luba@arm.com> wrote: > > > > On 4/1/20 12:15 PM, Amit Kucheria wrote: > > As part of moving the thermal bindings to YAML, split it up into 3 > > bindings: thermal sensors, cooling devices and thermal zones. > > > > The property #thermal-sensor-cells is required in each device that acts > > as a thermal sensor. It is used to uniquely identify the instance of the > > thermal sensor inside the system. > > > > Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org> > > Reviewed-by: Rob Herring <robh@kernel.org> > > --- > > .../bindings/thermal/thermal-sensor.yaml | 72 +++++++++++++++++++ > > 1 file changed, 72 insertions(+) > > create mode 100644 Documentation/devicetree/bindings/thermal/thermal-sensor.yaml > > > > diff --git a/Documentation/devicetree/bindings/thermal/thermal-sensor.yaml b/Documentation/devicetree/bindings/thermal/thermal-sensor.yaml > > new file mode 100644 > > index 0000000000000..920ee7667591d > > --- /dev/null > > +++ b/Documentation/devicetree/bindings/thermal/thermal-sensor.yaml > > @@ -0,0 +1,72 @@ > > +# SPDX-License-Identifier: (GPL-2.0) > > +# Copyright 2020 Linaro Ltd. > > +%YAML 1.2 > > +--- > > +$id: http://devicetree.org/schemas/thermal/thermal-sensor.yaml# > > +$schema: http://devicetree.org/meta-schemas/core.yaml# > > + > > +title: Thermal sensor binding > > + > > +maintainers: > > + - Amit Kucheria <amitk@kernel.org> > > + > > +description: | > > + Thermal management is achieved in devicetree by describing the sensor hardware > > + and the software abstraction of thermal zones required to take appropriate > > + action to mitigate thermal overloads. > > + > > + The following node types are used to completely describe a thermal management > > + system in devicetree: > > + - thermal-sensor: device that measures temperature, has SoC-specific bindings > > + - cooling-device: device used to dissipate heat either passively or artively > > s/artively/actively > > > + - thermal-zones: a container of the following node types used to describe all > > + thermal data for the platform > > + > > + This binding describes the thermal-sensor. > > + > > + Thermal sensor devices provide temperature sensing capabilities on thermal > > + zones. Typical devices are I2C ADC converters and bandgaps. Thermal sensor > > + devices may control one or more internal sensors. > > + > > +properties: > > + "#thermal-sensor-cells": > > + description: > > + Used to uniquely identify a thermal sensor instance within an IC. Will be > > + 0 on sensor nodes with only a single sensor and at least 1 on nodes > > + containing several internal sensors. > > + enum: [0, 1] > > + > > +examples: > > + - | > > + #include <dt-bindings/interrupt-controller/arm-gic.h> > > + > > + // Example 1: SDM845 TSENS > > + soc: soc@0 { > > + #address-cells = <2>; > > + #size-cells = <2>; > > + > > + /* ... */ > > + > > + tsens0: thermal-sensor@c263000 { > > + compatible = "qcom,sdm845-tsens", "qcom,tsens-v2"; > > + reg = <0 0x0c263000 0 0x1ff>, /* TM */ > > + <0 0x0c222000 0 0x1ff>; /* SROT */ > > + #qcom,sensors = <13>; > > + interrupts = <GIC_SPI 506 IRQ_TYPE_LEVEL_HIGH>, > > + <GIC_SPI 508 IRQ_TYPE_LEVEL_HIGH>; > > + interrupt-names = "uplow", "critical"; > > + #thermal-sensor-cells = <1>; > > + }; > > + > > + tsens1: thermal-sensor@c265000 { > > + compatible = "qcom,sdm845-tsens", "qcom,tsens-v2"; > > + reg = <0 0x0c265000 0 0x1ff>, /* TM */ > > + <0 0x0c223000 0 0x1ff>; /* SROT */ > > + #qcom,sensors = <8>; > > + interrupts = <GIC_SPI 507 IRQ_TYPE_LEVEL_HIGH>, > > + <GIC_SPI 509 IRQ_TYPE_LEVEL_HIGH>; > > + interrupt-names = "uplow", "critical"; > > + #thermal-sensor-cells = <1>; > > + }; > > + }; > > +... > > > > Apart from the above, looks good. > > Reviewed-by: Lukasz Luba <lukasz.luba@arm.com> Thanks for the review. Will spin a v5 with those trivial fixes.