@@ -153,6 +153,7 @@ struct socinfo_params {
u32 num_func_clusters;
u32 boot_cluster;
u32 boot_core;
+ u32 raw_package_type;
};
struct smem_image_version {
@@ -607,6 +608,10 @@ static void socinfo_debugfs_init(struct qcom_socinfo *qcom_socinfo,
&qcom_socinfo->info.fmt);
switch (qcom_socinfo->info.fmt) {
+ case SOCINFO_VERSION(0, 20):
+ qcom_socinfo->info.raw_package_type = __le32_to_cpu(info->raw_package_type);
+ debugfs_create_u32("raw_package_type", 0444, qcom_socinfo->dbg_root,
+ &qcom_socinfo->info.raw_package_type);
case SOCINFO_VERSION(0, 19):
qcom_socinfo->info.num_func_clusters = __le32_to_cpu(info->num_func_clusters);
qcom_socinfo->info.boot_cluster = __le32_to_cpu(info->boot_cluster);
@@ -82,6 +82,8 @@ struct socinfo {
__le32 num_func_clusters;
__le32 boot_cluster;
__le32 boot_core;
+ /* Version 20 */
+ __le32 raw_package_type;
};
/* Internal feature codes */
Add support for socinfo version 20. Version 20 adds a new field package id and its zeroth bit contain information that can be can be used to tune temperature thresholds on devices which might be able to withstand higher temperatures. Zeroth bit value 1 means that its heat dissipation is better and more relaxed thermal scheme can be put in place and 0 means a more aggressive scheme may be needed. Signed-off-by: Mukesh Ojha <mukesh.ojha@oss.qualcomm.com> --- Changes in v2: - Added debugfs entry and described more about the field in commit text. drivers/soc/qcom/socinfo.c | 5 +++++ include/linux/soc/qcom/socinfo.h | 2 ++ 2 files changed, 7 insertions(+)