@@ -53,3 +53,7 @@ config QCOM_LMH
input from temperature and current sensors. On many newer Qualcomm SoCs
LMh is configured in the firmware and this feature need not be enabled.
However, on certain SoCs like sdm845 LMh has to be configured from kernel.
+
+menu "Qualcomm QMI cooling drivers"
+source "drivers/thermal/qcom/qmi_cooling/Kconfig"
+endmenu
@@ -1,4 +1,6 @@
# SPDX-License-Identifier: GPL-2.0-only
+obj-$(CONFIG_QCOM_QMI_COOLING) += qmi_cooling/
+
obj-$(CONFIG_QCOM_TSENS) += qcom_tsens.o
qcom_tsens-y += tsens.o tsens-v2.o tsens-v1.o tsens-v0_1.o \
new file mode 100644
@@ -0,0 +1,14 @@
+# SPDX-License-Identifier: GPL-2.0-only
+
+config QCOM_QMI_COOLING
+ tristate "Qualcomm QMI cooling drivers"
+ depends on QCOM_RPROC_COMMON
+ depends on ARCH_QCOM || COMPILE_TEST
+ select QCOM_QMI_HELPERS
+ help
+ This enables the remote subsystem cooling devices. These cooling
+ devices will be used by Qualcomm chipset to place various remote
+ subsystem mitigations like remote processor passive mitigation,
+ remote subsystem voltage restriction at low temperatures etc.
+ The QMI cooling device will interface with remote subsystem
+ using Qualcomm remoteproc interface.
new file mode 100644
@@ -0,0 +1,3 @@
+# SPDX-License-Identifier: GPL-2.0-only
+obj-$(CONFIG_QCOM_QMI_COOLING) += qcom_cooling.o
+qcom_cooling-y += qcom_tmd_services.o qcom_qmi_cooling.o
Add Kconfig entry & compilation support for Qualcomm qmi cooling driver. Cc: daniel.lezcano@linaro.org Cc: rafael@kernel.org Cc: andersson@kernel.org Signed-off-by: Bhupesh Sharma <bhupesh.sharma@linaro.org> --- drivers/thermal/qcom/Kconfig | 4 ++++ drivers/thermal/qcom/Makefile | 2 ++ drivers/thermal/qcom/qmi_cooling/Kconfig | 14 ++++++++++++++ drivers/thermal/qcom/qmi_cooling/Makefile | 3 +++ 4 files changed, 23 insertions(+) create mode 100644 drivers/thermal/qcom/qmi_cooling/Kconfig create mode 100644 drivers/thermal/qcom/qmi_cooling/Makefile