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[thermal:,thermal/next] dt-bindings: thermal: tsens: Add sc8180x compatible

Message ID 162542174883.395.3150109364004806490.tip-bot2@tip-bot2
State New
Headers show
Series [thermal:,thermal/next] dt-bindings: thermal: tsens: Add sc8180x compatible | expand

Commit Message

thermal-bot for Julien Panis July 4, 2021, 6:02 p.m. UTC 
The following commit has been merged into the thermal/next branch of thermal:

Commit-ID:     481bd297291b59480b87f88f88fbcff59455dcc3
Gitweb:        https://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux.git//481bd297291b59480b87f88f88fbcff59455dcc3
Author:        Bjorn Andersson <bjorn.andersson@linaro.org>
AuthorDate:    Tue, 08 Jun 2021 13:16:38 -07:00
Committer:     Daniel Lezcano <daniel.lezcano@linaro.org>
CommitterDate: Sun, 04 Jul 2021 18:28:04 +02:00

dt-bindings: thermal: tsens: Add sc8180x compatible

The Qualcomm sc8180x platform has the usual tsens blocks, add compatible
for this.

Signed-off-by: Bjorn Andersson <bjorn.andersson@linaro.org>
Acked-by: Thara Gopinath <thara.gopinath@linaro.org>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210608201638.2136344-1-bjorn.andersson@linaro.org
---
 Documentation/devicetree/bindings/thermal/qcom-tsens.yaml | 1 +
 1 file changed, 1 insertion(+)
diff mbox series

Patch

diff --git a/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml b/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml
index 0d4cfe0..ccf70dd 100644
--- a/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml
+++ b/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml
@@ -47,6 +47,7 @@  properties:
               - qcom,msm8998-tsens
               - qcom,sc7180-tsens
               - qcom,sc7280-tsens
+              - qcom,sc8180x-tsens
               - qcom,sdm845-tsens
               - qcom,sm8150-tsens
               - qcom,sm8250-tsens