| Message ID | 20231206-icc-msm8909-v1-0-fe0dd632beff@kernkonzept.com |
|---|---|
| Headers | show |
| Series | interconnect: qcom: Add MSM8909 interconnect provider driver | expand |
On 06/12/2023 15:35, Stephan Gerhold wrote: > From: Adam Skladowski <a39.skl@gmail.com> > > Add bindings for Qualcomm MSM8909 Network-On-Chip interconnect devices. > > Signed-off-by: Adam Skladowski <a39.skl@gmail.com> > [Stephan: Drop separate mm-snoc that exists downstream since it's > actually the same NoC as SNoC in hardware] > Signed-off-by: Stephan Gerhold <stephan.gerhold@kernkonzept.com> > --- > .../devicetree/bindings/interconnect/qcom,rpm.yaml | 3 + Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Best regards, Krzysztof
Add bindings and driver for the three MSM8909 NoCs/interconnects: BIMC, SNoC and PCNoC. The driver allows scaling the bus bandwidths for better power management. Signed-off-by: Stephan Gerhold <stephan.gerhold@kernkonzept.com> --- Adam Skladowski (2): dt-bindings: interconnect: Add Qualcomm MSM8909 DT bindings interconnect: qcom: Add MSM8909 interconnect provider driver .../devicetree/bindings/interconnect/qcom,rpm.yaml | 3 + drivers/interconnect/qcom/Kconfig | 9 + drivers/interconnect/qcom/Makefile | 2 + drivers/interconnect/qcom/msm8909.c | 1329 ++++++++++++++++++++ include/dt-bindings/interconnect/qcom,msm8909.h | 93 ++ 5 files changed, 1436 insertions(+) --- base-commit: feaf241ae2da2a73cb421473f52a4732128a996f change-id: 20231206-icc-msm8909-74f28646ff29 Best regards,