Message ID | 20230221180710.2781027-1-daniel.lezcano@linaro.org |
---|---|
Headers | show |
Series | Self-encapsulate the thermal zone device structure | expand |
On 2/21/23 10:06, Daniel Lezcano wrote: > The thermal zone device structure is exposed to the different drivers > and obviously they access the internals while that should be > restricted to the core thermal code. > > In order to self-encapsulate the thermal core code, we need to prevent > the drivers accessing directly the thermal zone structure and provide > accessor functions to deal with. > > Provide an accessor to the 'devdata' structure and make use of it in > the different drivers. > > No functional changes intended. > > Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> > Acked-by: Guenter Roeck <linux@roeck-us.net> #hwmon > Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> #R-Car > Acked-by: Mark Brown <broonie@kernel.org> > Reviewed-by: Ido Schimmel <idosch@nvidia.com> #mlxsw > Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com> #MediaTek auxadc and lvts > Reviewed-by: Balsam CHIHI <bchihi@baylibre.com> #Mediatek lvts > Acked-by: Gregory Greenman <gregory.greenman@intel.com> #iwlwifi > Reviewed-by: Adam Ward <DLG-Adam.Ward.opensource@dm.renesas.com> #da9062 > Reviewed-by: Baolin Wang <baolin.wang@linux.alibaba.com> #spread > Acked-by: Sebastian Reichel <sebastian.reichel@collabora.com> #power_supply Acked-by: Florian Fainelli <f.fainelli@gmail.com> #Broadcom