| Message ID | 20220912085049.3517140-4-bhupesh.sharma@linaro.org |
|---|---|
| State | New |
| Headers | show |
| Series | thermal: Introduce Qualcomm Cooling Driver suppport | expand |
On Mon, Sep 12, 2022 at 02:20:48PM +0530, Bhupesh Sharma wrote: > Add qcom,qmi-tmd-device and qcom,tmd-device yaml bindings. > > Qualcomm QMI based TMD cooling device(s) are used for various > mitigations for remote subsystem(s) including remote processor > mitigation, rail voltage restriction etc. > > Each child node represents one remote subsystem and each child > of this subsystem in-turn represents separate TMD cooling device. > > Cc: daniel.lezcano@linaro.org > Cc: rafael@kernel.org > Cc: andersson@kernel.org > Cc: robh@kernel.org > Signed-off-by: Bhupesh Sharma <bhupesh.sharma@linaro.org> > --- > .../bindings/thermal/qcom,qmi-tmd-device.yaml | 78 +++++++++++ > .../bindings/thermal/qcom,tmd-device.yaml | 122 ++++++++++++++++++ > include/dt-bindings/thermal/qcom,tmd.h | 14 ++ > 3 files changed, 214 insertions(+) > create mode 100644 Documentation/devicetree/bindings/thermal/qcom,qmi-tmd-device.yaml > create mode 100644 Documentation/devicetree/bindings/thermal/qcom,tmd-device.yaml > create mode 100644 include/dt-bindings/thermal/qcom,tmd.h > > diff --git a/Documentation/devicetree/bindings/thermal/qcom,qmi-tmd-device.yaml b/Documentation/devicetree/bindings/thermal/qcom,qmi-tmd-device.yaml > new file mode 100644 > index 000000000000..dfda5b611a93 > --- /dev/null > +++ b/Documentation/devicetree/bindings/thermal/qcom,qmi-tmd-device.yaml > @@ -0,0 +1,78 @@ > +# SPDX-License-Identifier: (GPL-2.0 OR BSD-2-Clause) > + > +%YAML 1.2 > +--- > +$id: "http://devicetree.org/schemas/thermal/qcom,qmi-tmd-device.yaml#" > +$schema: "http://devicetree.org/meta-schemas/core.yaml#" > + > +title: Qualcomm QMI based thermal mitigation (TMD) cooling devices. > + > +maintainers: > + - Bhupesh Sharma <bhupesh.sharma@linaro.org> > + > +description: > + Qualcomm QMI based TMD cooling device(s) are used for various > + mitigations for remote subsystem(s) including remote processor > + mitigation, rail voltage restriction etc. > + > +properties: > + $nodename: > + const: qmi-tmd-devices > + > + compatible: > + items: > + - const: qcom,qmi-tmd-devices > + > + modem0: > + $ref: /schemas/thermal/qcom,tmd-device.yaml# > + > + adsp: > + $ref: /schemas/thermal/qcom,tmd-device.yaml# > + > + cdsp: > + $ref: /schemas/thermal/qcom,tmd-device.yaml# > + > + slpi: > + $ref: /schemas/thermal/qcom,tmd-device.yaml# > + > +required: > + - compatible > + > +unevaluatedProperties: false > + > +examples: > + - | > + #include <dt-bindings/thermal/qcom,tmd.h> > + qmi-tmd-devices { > + compatible = "qcom,qmi-tmd-devices"; > + > + modem0 { > + qcom,instance-id = <MODEM0_INSTANCE_ID>; > + > + modem0_pa: tmd-device0 { > + label = "pa"; > + #cooling-cells = <2>; > + }; > + > + modem0_proc: tmd-device1 { > + label = "modem"; > + #cooling-cells = <2>; > + }; > + > + modem0_current: tmd-device2 { > + label = "modem_current"; > + #cooling-cells = <2>; > + }; > + > + modem0_skin: tmd-device3 { > + label = "modem_skin"; > + #cooling-cells = <2>; > + }; > + > + modem0_vdd: tmd-device4 { > + label = "cpuv_restriction_cold"; > + #cooling-cells = <2>; > + }; > + }; > + }; > +... > diff --git a/Documentation/devicetree/bindings/thermal/qcom,tmd-device.yaml b/Documentation/devicetree/bindings/thermal/qcom,tmd-device.yaml > new file mode 100644 > index 000000000000..38ac62f03376 > --- /dev/null > +++ b/Documentation/devicetree/bindings/thermal/qcom,tmd-device.yaml > @@ -0,0 +1,122 @@ > +# SPDX-License-Identifier: (GPL-2.0-only OR BSD-2-Clause) > + > +%YAML 1.2 > +--- > +$id: "http://devicetree.org/schemas/thermal/qcom,tmd-device.yaml#" > +$schema: "http://devicetree.org/meta-schemas/core.yaml#" > + > +title: Qualcomm thermal mitigation (TMD) cooling devices > + > +maintainers: > + - Bhupesh Sharma <bhupesh.sharma@linaro.org> > + > +description: > + Qualcomm thermal mitigation (TMD) cooling devices. Each child node > + represents one remote subsystem and each child of this subsystem in-turn > + represents separate cooling devices. > + > +properties: > + $nodename: > + pattern: "^(modem|adsp|cdsp|slpi[0-9])?$" Node names are supposed to reflect the class of device, not instance. > + > + qcom,instance-id: > + $ref: /schemas/types.yaml#/definitions/uint32 > + description: > + Remote subsystem QMI server instance id to be used for communicating with QMI. In general, we don't do instance indexes in DT. You'll need to explain where the value comes from. > + > +patternProperties: > + "^tmd-device[0-9]?$": A cooling provider should have a standard node name. Not sure offhand if we defined one in the spec or not yet. > + type: object > + description: > + Subnodes indicating tmd cooling device of a specific category. > + properties: > + label: > + maxItems: 1 > + description: | > + Remote subsystem device identifier. Acceptable device names - > + "pa" -> for pa cooling device, > + "cpuv_restriction_cold" -> for vdd restriction, > + "cx_vdd_limit" -> for vdd limit, > + "modem" -> for processor passive cooling device, > + "modem_current" -> for current limiting device, > + "modem_bw" -> for bus bandwidth limiting device, > + "cpr_cold" -> for cpr restriction. > + > + "#cooling-cells": > + const: 2 > + > + required: > + - label > + - "#cooling-cells" > + > + additionalProperties: false > + > +required: > + - qcom,instance-id > + > +additionalProperties: false > + > +examples: > + - | > + #include <dt-bindings/thermal/qcom,tmd.h> > + modem0 { > + qcom,instance-id = <MODEM0_INSTANCE_ID>; > + > + modem0_pa: tmd-device0 { > + label = "pa"; > + #cooling-cells = <2>; > + }; > + > + modem0_proc: tmd-device1 { > + label = "modem"; > + #cooling-cells = <2>; > + }; > + > + modem0_current: tmd-device2 { > + label = "modem_current"; > + #cooling-cells = <2>; > + }; > + > + modem0_skin: tmd-device3 { > + label = "modem_skin"; > + #cooling-cells = <2>; > + }; > + > + modem0_vdd: tmd-device4 { > + label = "cpuv_restriction_cold"; > + #cooling-cells = <2>; > + }; > + }; > + > + - | > + #include <dt-bindings/thermal/qcom,tmd.h> > + adsp { > + qcom,instance-id = <ADSP_INSTANCE_ID>; > + > + adsp_vdd: tmd-device1 { > + label = "cpuv_restriction_cold"; > + #cooling-cells = <2>; > + }; > + }; > + > + - | > + #include <dt-bindings/thermal/qcom,tmd.h> > + cdsp { > + qcom,instance-id = <CDSP_INSTANCE_ID>; > + > + cdsp_vdd: tmd-device1 { > + label = "cpuv_restriction_cold"; > + #cooling-cells = <2>; > + }; > + }; > + > + - | > + #include <dt-bindings/thermal/qcom,tmd.h> > + slpi { > + qcom,instance-id = <SLPI_INSTANCE_ID>; > + > + slpi_vdd: tmd-device1 { > + label = "cpuv_restriction_cold"; > + #cooling-cells = <2>; > + }; > + }; > diff --git a/include/dt-bindings/thermal/qcom,tmd.h b/include/dt-bindings/thermal/qcom,tmd.h > new file mode 100644 > index 000000000000..5ede4422e04e > --- /dev/null > +++ b/include/dt-bindings/thermal/qcom,tmd.h > @@ -0,0 +1,14 @@ > +/* SPDX-License-Identifier: GPL-2.0 */ Dual license. > +/* > + * This header provides constants for the Qualcomm TMD instances. > + */ > + > +#ifndef _DT_BINDINGS_THERMAL_QCOM_TMD_H_ > +#define _DT_BINDINGS_THERMAL_QCOM_TMD_H_ > + > +#define MODEM0_INSTANCE_ID 0x0 > +#define ADSP_INSTANCE_ID 0x1 > +#define CDSP_INSTANCE_ID 0x43 > +#define SLPI_INSTANCE_ID 0x53 > + > +#endif > -- > 2.37.1 > >
On Mon, Sep 12, 2022 at 02:20:48PM +0530, Bhupesh Sharma wrote: > Add qcom,qmi-tmd-device and qcom,tmd-device yaml bindings. Looks like a duplicate of $subject. > > Qualcomm QMI based TMD cooling device(s) are used for various What is "TMD" an abbreviation of? > mitigations for remote subsystem(s) including remote processor > mitigation, rail voltage restriction etc. > > Each child node represents one remote subsystem and each child > of this subsystem in-turn represents separate TMD cooling device. > > Cc: daniel.lezcano@linaro.org > Cc: rafael@kernel.org > Cc: andersson@kernel.org > Cc: robh@kernel.org > Signed-off-by: Bhupesh Sharma <bhupesh.sharma@linaro.org> > --- > .../bindings/thermal/qcom,qmi-tmd-device.yaml | 78 +++++++++++ > .../bindings/thermal/qcom,tmd-device.yaml | 122 ++++++++++++++++++ > include/dt-bindings/thermal/qcom,tmd.h | 14 ++ > 3 files changed, 214 insertions(+) > create mode 100644 Documentation/devicetree/bindings/thermal/qcom,qmi-tmd-device.yaml > create mode 100644 Documentation/devicetree/bindings/thermal/qcom,tmd-device.yaml > create mode 100644 include/dt-bindings/thermal/qcom,tmd.h > > diff --git a/Documentation/devicetree/bindings/thermal/qcom,qmi-tmd-device.yaml b/Documentation/devicetree/bindings/thermal/qcom,qmi-tmd-device.yaml > new file mode 100644 > index 000000000000..dfda5b611a93 > --- /dev/null > +++ b/Documentation/devicetree/bindings/thermal/qcom,qmi-tmd-device.yaml > @@ -0,0 +1,78 @@ > +# SPDX-License-Identifier: (GPL-2.0 OR BSD-2-Clause) > + > +%YAML 1.2 > +--- > +$id: "http://devicetree.org/schemas/thermal/qcom,qmi-tmd-device.yaml#" > +$schema: "http://devicetree.org/meta-schemas/core.yaml#" > + > +title: Qualcomm QMI based thermal mitigation (TMD) cooling devices. > + > +maintainers: > + - Bhupesh Sharma <bhupesh.sharma@linaro.org> > + > +description: > + Qualcomm QMI based TMD cooling device(s) are used for various > + mitigations for remote subsystem(s) including remote processor > + mitigation, rail voltage restriction etc. > + > +properties: > + $nodename: > + const: qmi-tmd-devices > + > + compatible: > + items: > + - const: qcom,qmi-tmd-devices > + > + modem0: > + $ref: /schemas/thermal/qcom,tmd-device.yaml# > + > + adsp: > + $ref: /schemas/thermal/qcom,tmd-device.yaml# > + > + cdsp: > + $ref: /schemas/thermal/qcom,tmd-device.yaml# > + > + slpi: > + $ref: /schemas/thermal/qcom,tmd-device.yaml# > + > +required: > + - compatible > + > +unevaluatedProperties: false > + > +examples: > + - | > + #include <dt-bindings/thermal/qcom,tmd.h> > + qmi-tmd-devices { Looking at the implementation I see no relationship between the individual instances (i.e. between the children of this node). My suggestion is that you drop this top-level node and just list out modem, adsp etc individually - which would mean that you can remove one layer of indirection in the driver, as each instance would just need a list of cooling-devices. > + compatible = "qcom,qmi-tmd-devices"; > + > + modem0 { So you would move the compatible here. > + qcom,instance-id = <MODEM0_INSTANCE_ID>; > + > + modem0_pa: tmd-device0 { > + label = "pa"; > + #cooling-cells = <2>; > + }; > + > + modem0_proc: tmd-device1 { > + label = "modem"; > + #cooling-cells = <2>; > + }; > + > + modem0_current: tmd-device2 { > + label = "modem_current"; > + #cooling-cells = <2>; > + }; > + > + modem0_skin: tmd-device3 { > + label = "modem_skin"; > + #cooling-cells = <2>; > + }; > + > + modem0_vdd: tmd-device4 { > + label = "cpuv_restriction_cold"; > + #cooling-cells = <2>; > + }; > + }; > + }; > +... > diff --git a/Documentation/devicetree/bindings/thermal/qcom,tmd-device.yaml b/Documentation/devicetree/bindings/thermal/qcom,tmd-device.yaml > new file mode 100644 > index 000000000000..38ac62f03376 > --- /dev/null > +++ b/Documentation/devicetree/bindings/thermal/qcom,tmd-device.yaml > @@ -0,0 +1,122 @@ > +# SPDX-License-Identifier: (GPL-2.0-only OR BSD-2-Clause) > + > +%YAML 1.2 > +--- > +$id: "http://devicetree.org/schemas/thermal/qcom,tmd-device.yaml#" > +$schema: "http://devicetree.org/meta-schemas/core.yaml#" > + I see no reason for splitting this into a separate binding. > +title: Qualcomm thermal mitigation (TMD) cooling devices > + > +maintainers: > + - Bhupesh Sharma <bhupesh.sharma@linaro.org> > + > +description: > + Qualcomm thermal mitigation (TMD) cooling devices. Each child node > + represents one remote subsystem and each child of this subsystem in-turn > + represents separate cooling devices. > + > +properties: > + $nodename: > + pattern: "^(modem|adsp|cdsp|slpi[0-9])?$" > + > + qcom,instance-id: > + $ref: /schemas/types.yaml#/definitions/uint32 > + description: > + Remote subsystem QMI server instance id to be used for communicating with QMI. > + > +patternProperties: > + "^tmd-device[0-9]?$": So max 10 cooling devices per remote? > + type: object > + description: > + Subnodes indicating tmd cooling device of a specific category. > + properties: > + label: > + maxItems: 1 > + description: | > + Remote subsystem device identifier. Acceptable device names - > + "pa" -> for pa cooling device, > + "cpuv_restriction_cold" -> for vdd restriction, > + "cx_vdd_limit" -> for vdd limit, > + "modem" -> for processor passive cooling device, > + "modem_current" -> for current limiting device, > + "modem_bw" -> for bus bandwidth limiting device, > + "cpr_cold" -> for cpr restriction. Afaict there are about 50 valid cooling devices listed in the driver. Why limit this to these 7 here? > + > + "#cooling-cells": > + const: 2 > + > + required: > + - label > + - "#cooling-cells" > + > + additionalProperties: false > + > +required: > + - qcom,instance-id > + > +additionalProperties: false > + > +examples: > + - | > + #include <dt-bindings/thermal/qcom,tmd.h> > + modem0 { As written here this example is incomplete, as these nodes can't live on their own. But this is actually what I propose above. > + qcom,instance-id = <MODEM0_INSTANCE_ID>; > + > + modem0_pa: tmd-device0 { > + label = "pa"; > + #cooling-cells = <2>; > + }; > + > + modem0_proc: tmd-device1 { > + label = "modem"; > + #cooling-cells = <2>; > + }; > + > + modem0_current: tmd-device2 { > + label = "modem_current"; > + #cooling-cells = <2>; > + }; > + > + modem0_skin: tmd-device3 { > + label = "modem_skin"; > + #cooling-cells = <2>; > + }; > + > + modem0_vdd: tmd-device4 { > + label = "cpuv_restriction_cold"; > + #cooling-cells = <2>; > + }; > + }; > + > + - | > + #include <dt-bindings/thermal/qcom,tmd.h> > + adsp { > + qcom,instance-id = <ADSP_INSTANCE_ID>; > + > + adsp_vdd: tmd-device1 { > + label = "cpuv_restriction_cold"; > + #cooling-cells = <2>; > + }; > + }; > + > + - | > + #include <dt-bindings/thermal/qcom,tmd.h> > + cdsp { > + qcom,instance-id = <CDSP_INSTANCE_ID>; > + > + cdsp_vdd: tmd-device1 { > + label = "cpuv_restriction_cold"; > + #cooling-cells = <2>; > + }; > + }; > + > + - | > + #include <dt-bindings/thermal/qcom,tmd.h> > + slpi { > + qcom,instance-id = <SLPI_INSTANCE_ID>; > + > + slpi_vdd: tmd-device1 { > + label = "cpuv_restriction_cold"; > + #cooling-cells = <2>; > + }; > + }; > diff --git a/include/dt-bindings/thermal/qcom,tmd.h b/include/dt-bindings/thermal/qcom,tmd.h > new file mode 100644 > index 000000000000..5ede4422e04e > --- /dev/null > +++ b/include/dt-bindings/thermal/qcom,tmd.h This is a quite generic name, how about qcom,qmi-cooling.h? > @@ -0,0 +1,14 @@ > +/* SPDX-License-Identifier: GPL-2.0 */ > +/* > + * This header provides constants for the Qualcomm TMD instances. > + */ > + > +#ifndef _DT_BINDINGS_THERMAL_QCOM_TMD_H_ > +#define _DT_BINDINGS_THERMAL_QCOM_TMD_H_ > + > +#define MODEM0_INSTANCE_ID 0x0 > +#define ADSP_INSTANCE_ID 0x1 > +#define CDSP_INSTANCE_ID 0x43 > +#define SLPI_INSTANCE_ID 0x53 QMI cooling isn't the only thing dealing with "instance id" and all of them would deal with instances ids of type modem, adsp, cdsp, slpi etc. As such I think these are too generic, how about QMI_COOLING_ADSP etc? Regards, Bjorn > + > +#endif > -- > 2.37.1 >
diff --git a/Documentation/devicetree/bindings/thermal/qcom,qmi-tmd-device.yaml b/Documentation/devicetree/bindings/thermal/qcom,qmi-tmd-device.yaml new file mode 100644 index 000000000000..dfda5b611a93 --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/qcom,qmi-tmd-device.yaml @@ -0,0 +1,78 @@ +# SPDX-License-Identifier: (GPL-2.0 OR BSD-2-Clause) + +%YAML 1.2 +--- +$id: "http://devicetree.org/schemas/thermal/qcom,qmi-tmd-device.yaml#" +$schema: "http://devicetree.org/meta-schemas/core.yaml#" + +title: Qualcomm QMI based thermal mitigation (TMD) cooling devices. + +maintainers: + - Bhupesh Sharma <bhupesh.sharma@linaro.org> + +description: + Qualcomm QMI based TMD cooling device(s) are used for various + mitigations for remote subsystem(s) including remote processor + mitigation, rail voltage restriction etc. + +properties: + $nodename: + const: qmi-tmd-devices + + compatible: + items: + - const: qcom,qmi-tmd-devices + + modem0: + $ref: /schemas/thermal/qcom,tmd-device.yaml# + + adsp: + $ref: /schemas/thermal/qcom,tmd-device.yaml# + + cdsp: + $ref: /schemas/thermal/qcom,tmd-device.yaml# + + slpi: + $ref: /schemas/thermal/qcom,tmd-device.yaml# + +required: + - compatible + +unevaluatedProperties: false + +examples: + - | + #include <dt-bindings/thermal/qcom,tmd.h> + qmi-tmd-devices { + compatible = "qcom,qmi-tmd-devices"; + + modem0 { + qcom,instance-id = <MODEM0_INSTANCE_ID>; + + modem0_pa: tmd-device0 { + label = "pa"; + #cooling-cells = <2>; + }; + + modem0_proc: tmd-device1 { + label = "modem"; + #cooling-cells = <2>; + }; + + modem0_current: tmd-device2 { + label = "modem_current"; + #cooling-cells = <2>; + }; + + modem0_skin: tmd-device3 { + label = "modem_skin"; + #cooling-cells = <2>; + }; + + modem0_vdd: tmd-device4 { + label = "cpuv_restriction_cold"; + #cooling-cells = <2>; + }; + }; + }; +... diff --git a/Documentation/devicetree/bindings/thermal/qcom,tmd-device.yaml b/Documentation/devicetree/bindings/thermal/qcom,tmd-device.yaml new file mode 100644 index 000000000000..38ac62f03376 --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/qcom,tmd-device.yaml @@ -0,0 +1,122 @@ +# SPDX-License-Identifier: (GPL-2.0-only OR BSD-2-Clause) + +%YAML 1.2 +--- +$id: "http://devicetree.org/schemas/thermal/qcom,tmd-device.yaml#" +$schema: "http://devicetree.org/meta-schemas/core.yaml#" + +title: Qualcomm thermal mitigation (TMD) cooling devices + +maintainers: + - Bhupesh Sharma <bhupesh.sharma@linaro.org> + +description: + Qualcomm thermal mitigation (TMD) cooling devices. Each child node + represents one remote subsystem and each child of this subsystem in-turn + represents separate cooling devices. + +properties: + $nodename: + pattern: "^(modem|adsp|cdsp|slpi[0-9])?$" + + qcom,instance-id: + $ref: /schemas/types.yaml#/definitions/uint32 + description: + Remote subsystem QMI server instance id to be used for communicating with QMI. + +patternProperties: + "^tmd-device[0-9]?$": + type: object + description: + Subnodes indicating tmd cooling device of a specific category. + properties: + label: + maxItems: 1 + description: | + Remote subsystem device identifier. Acceptable device names - + "pa" -> for pa cooling device, + "cpuv_restriction_cold" -> for vdd restriction, + "cx_vdd_limit" -> for vdd limit, + "modem" -> for processor passive cooling device, + "modem_current" -> for current limiting device, + "modem_bw" -> for bus bandwidth limiting device, + "cpr_cold" -> for cpr restriction. + + "#cooling-cells": + const: 2 + + required: + - label + - "#cooling-cells" + + additionalProperties: false + +required: + - qcom,instance-id + +additionalProperties: false + +examples: + - | + #include <dt-bindings/thermal/qcom,tmd.h> + modem0 { + qcom,instance-id = <MODEM0_INSTANCE_ID>; + + modem0_pa: tmd-device0 { + label = "pa"; + #cooling-cells = <2>; + }; + + modem0_proc: tmd-device1 { + label = "modem"; + #cooling-cells = <2>; + }; + + modem0_current: tmd-device2 { + label = "modem_current"; + #cooling-cells = <2>; + }; + + modem0_skin: tmd-device3 { + label = "modem_skin"; + #cooling-cells = <2>; + }; + + modem0_vdd: tmd-device4 { + label = "cpuv_restriction_cold"; + #cooling-cells = <2>; + }; + }; + + - | + #include <dt-bindings/thermal/qcom,tmd.h> + adsp { + qcom,instance-id = <ADSP_INSTANCE_ID>; + + adsp_vdd: tmd-device1 { + label = "cpuv_restriction_cold"; + #cooling-cells = <2>; + }; + }; + + - | + #include <dt-bindings/thermal/qcom,tmd.h> + cdsp { + qcom,instance-id = <CDSP_INSTANCE_ID>; + + cdsp_vdd: tmd-device1 { + label = "cpuv_restriction_cold"; + #cooling-cells = <2>; + }; + }; + + - | + #include <dt-bindings/thermal/qcom,tmd.h> + slpi { + qcom,instance-id = <SLPI_INSTANCE_ID>; + + slpi_vdd: tmd-device1 { + label = "cpuv_restriction_cold"; + #cooling-cells = <2>; + }; + }; diff --git a/include/dt-bindings/thermal/qcom,tmd.h b/include/dt-bindings/thermal/qcom,tmd.h new file mode 100644 index 000000000000..5ede4422e04e --- /dev/null +++ b/include/dt-bindings/thermal/qcom,tmd.h @@ -0,0 +1,14 @@ +/* SPDX-License-Identifier: GPL-2.0 */ +/* + * This header provides constants for the Qualcomm TMD instances. + */ + +#ifndef _DT_BINDINGS_THERMAL_QCOM_TMD_H_ +#define _DT_BINDINGS_THERMAL_QCOM_TMD_H_ + +#define MODEM0_INSTANCE_ID 0x0 +#define ADSP_INSTANCE_ID 0x1 +#define CDSP_INSTANCE_ID 0x43 +#define SLPI_INSTANCE_ID 0x53 + +#endif
Add qcom,qmi-tmd-device and qcom,tmd-device yaml bindings. Qualcomm QMI based TMD cooling device(s) are used for various mitigations for remote subsystem(s) including remote processor mitigation, rail voltage restriction etc. Each child node represents one remote subsystem and each child of this subsystem in-turn represents separate TMD cooling device. Cc: daniel.lezcano@linaro.org Cc: rafael@kernel.org Cc: andersson@kernel.org Cc: robh@kernel.org Signed-off-by: Bhupesh Sharma <bhupesh.sharma@linaro.org> --- .../bindings/thermal/qcom,qmi-tmd-device.yaml | 78 +++++++++++ .../bindings/thermal/qcom,tmd-device.yaml | 122 ++++++++++++++++++ include/dt-bindings/thermal/qcom,tmd.h | 14 ++ 3 files changed, 214 insertions(+) create mode 100644 Documentation/devicetree/bindings/thermal/qcom,qmi-tmd-device.yaml create mode 100644 Documentation/devicetree/bindings/thermal/qcom,tmd-device.yaml create mode 100644 include/dt-bindings/thermal/qcom,tmd.h