Message ID | 20220727210253.3794069-1-daniel.lezcano@linexp.org |
---|---|
Headers | show |
Series | New thermal OF code | expand |
Hi Rafael, On 28/07/2022 16:37, Rafael J. Wysocki wrote: > Hi Daniel, > > On Wed, Jul 27, 2022 at 11:46 PM Daniel Lezcano > <daniel.lezcano@linaro.org> wrote: >> >> >> Hi Rafael, >> >> we are close to release v5.19. >> >> I want to send a PR this week but it would be nice if this series could >> be part of it, so the trip point rework we discussed earlier (it is a >> long series) could be merged more easily for v5.21-rc1 as it will depend >> on these changes. >> >> This series was tested on different platforms, rk3399, broadcom and >> rcar. The external drivers as ata, touchscreen, regulator, hwmon were >> acked/reviewed and some other thermal drivers reviewed also. Some others >> remain without feedback because the maintainer is unresponsive or the >> driver is orphaned, falling under the thermal framework maintenance >> umbrella. All the drivers changes are the same. >> >> I do believe it does a nice cleanup and consolidation of the OF thermal >> code and realign it with the core thermal framework. >> >> Is it ok to merge the series? > > I would prefer to put it into linux-next for a few days. > > Why don't you send 2 pull requests, one with all of the other material > you have for 5.20 and another one with this series (it may be on top > of the first one)? > > I will be able to defer pushing the second one till the second half of > the merge window. I setup a branch with the patches and the fixes. https://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux.git/log/?h=thermal/v6.0-rc1-2 Is there still time for a PR ?